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5.6 Switching Characteristics—RESET
5.6 Switching Characteristics—RESET
Parameter
RESET# minimum pulse width low
All bidirectional pins high-Z after RESET# low
Configuration pins setup before RESET# high
Configuration pins hold after RESET# high
Symbol
T rstl
T rst2z
T rstsu
T rsthld
Min
1
—
50
20
Max
—
100
—
—
Unit
ms
ns
ns
ns
RESET#
HS[3:0]
All Bidirectional
Pins
T rst2z
T rstsu T rsthld
T rstl
Figure 5-1. RESET Timing
5.7 Switching Characteristics—XTI
Parameter
Symbol
Min
Max
Unit
External Crystal operating
frequency 1
F xtal
11.2896
27
MHz
XTI period
XTI high time
XTI low time
External Crystal Load Capacitance (parallel resonant) 2
External Crystal Equivalent Series Resistance
T clki
T clkih
T clkil
C L
ESR
33.3
13.3
13.3
10
—
100
—
—
18
50
ns
ns
ns
pF
Ω
1.Part characterized with the following crystal frequency values: 11.2896, 12.288, 18.432, 24.576, & 27 MH.z
2.C L refers to the total load capacitance as specified by the crystal manufacturer. Crystals that require a C L outside this range should be avoided. The
crystal oscillator circuit design should follow the crystal manufacturer ’s recommendation for load capacitor selection.
XTI
t clkih
t clkil
T clki
Figure 5-2. XTI Timing
5.8 Switching Characteristics—Internal Clock
Parameter
Symbol
Min
Max
Unit
Internal DCLK
frequency 1
F dclk
—
—
MHz
11
CS4852x-CQZ
CS4854x-CQZ
CS4856x-CQZ
CS4854x-DQZ
CS4856x-DQZ
F xtal
F xtal
F xtal
F xtal
F xtal
150
150
150
150
150
DS734F5
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